Intertek offers protection and functionality certification to nationally regarded specifications for a wide array of products. Our item directories let you simply confirm items that have our marks.
Our component failure analysis is customized for your special requirements and we use a suite of investigative approaches which include:
This guideline will deliver a comprehensive overview of component failure, such as the brings about, consequences, and finest practices for mitigation. The guide will go over the subsequent subjects:
Temperature extremes: Exposing a component to temperature extremes that might cause product degradation or stress.
By coming to Intertek for failure analysis of the components, our know-how and expertise will establish the basis reason behind failure and present you with the mandatory details necessary for solving the problem, remedial action and stopping recurrence.
Derating methods—managing sections at sixty% potential—prolonged industrial robotic lifespans by 41% in our trials. We assist engineers select supplies that withstand unique environmental stresses, like salt spray in maritime electronics.
Testing Evaluating how your products and services satisfy more info and exceed top quality, basic safety, sustainability and performance requirements.
A: Frequent failure analysis procedures contain Visible inspection and non-destructive screening, metallurgical analysis and fractography, and root bring about analysis and failure mode identification.
Failure investigation plays a key job in Keeping companies legally liable in merchandise liability conditions.
Assembly flaws undermine even strong styles. Chilly solder joints crack below thermal biking, while misaligned connectors generate intermittent faults. We not long ago traced 41% of guarantee promises in IoT gadgets to insufficient flux cleaning in the course of PCB assembly.
Actual physical forces generate noticeable wounds in your electronics. Vibration from equipment or mishandling for the duration of delivery usually cracks solder joints or fractures circuit boards. These flaws disrupt electrical paths, creating intermittent faults that frustrate experts.
Developing layers of protection from electronic program breakdowns starts where most ignore—in advance of areas achieve your assembly line.
Layout and producing mistakes may result in component failure by creating pressure concentrations or other weaknesses during the component. Typical layout and producing errors incorporate:
Material high-quality instantly impacts longevity. Contaminated epoxy in IC packaging brought about untimely failures in industrial sensors final quarter. Our root trigger analysis revealed substandard Uncooked elements from a secondary supplier.